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搪塑模具制备中电镀用环氧树脂芯模固化过程的流变动力学研究

窦艳丽 刘新春 张欢欢 许东华 管东波 石彤非 姚卫国

高校化学工程学报2016,Vol.30Issue(2):305-310,6.
高校化学工程学报2016,Vol.30Issue(2):305-310,6.DOI:10.3969/j.issn.1003-9015.2016.02.008

搪塑模具制备中电镀用环氧树脂芯模固化过程的流变动力学研究

Rheological Studies on Curing Kinetics of Epoxy Resins for Electroplating in Slush Mold Preparation

窦艳丽 1刘新春 1张欢欢 2许东华 3管东波 2石彤非 1姚卫国2

作者信息

  • 1. 吉林大学材料科学与工程学院,教育部汽车材料重点实验室,吉林长春 130025
  • 2. 中国科学院长春应用化学研究所,高分子物理与化学国家重点实验室,吉林长春130022
  • 3. 中国科学院大学,北京100049
  • 折叠

摘要

Abstract

The curing process of epoxy resins for electroplating is important for slush mold preparation. This process was studied using rheological methods in this study. The results show that bisphenol-A epoxy resins react with polyamine and the degree of curing increases with time. The degree of curing increases from being slowly to being fast and finally become slowly again to stabilized. Meanwhile, the temperature has an important effect on curing rates. As the reaction temperature increases, the curing rate of the two-component epoxy resin speeds up, while the curing rate declines as the reaction temperature decreases. Therefore, the time that can be used to handle the epoxy resin for making mold becomes longer. The curing kinetic equation for the epoxy resin is established, and the relationship between curing rate and reaction temperature is also obtained. The activation energy for the curing process is acquired. It is concluded that the curing kinetics of the epoxy resin follows the Kamal autocatalytic kinetic model.

关键词

环氧树脂/搪塑/交联固化/流变动力学

Key words

epoxy resin/slush mold/curing/rheological dynamics

分类

化学化工

引用本文复制引用

窦艳丽,刘新春,张欢欢,许东华,管东波,石彤非,姚卫国..搪塑模具制备中电镀用环氧树脂芯模固化过程的流变动力学研究[J].高校化学工程学报,2016,30(2):305-310,6.

基金项目

国家自然科学基金(21274152,51473168,21234007,21174146);973国家重点基础研究发展规划项目(2010CB631100);吉林省科技厅科技发展计划项目(20120319);汽车内饰产品搪塑工艺关键技术研究(2012362)。 (21274152,51473168,21234007,21174146)

高校化学工程学报

OA北大核心CSCDCSTPCD

1003-9015

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