金刚石与磨料磨具工程2016，Vol.36Issue(2)：19-23,5.DOI:10.13394/j.cnki.jgszz.2016.2.0005
硅片自旋转磨削中基于作用力的微观接触仿真研究
Simulation of micro contact based on interacting force in self rotating grinding of silicon wafer
摘要
Abstract
Self rotating grinding with cup diamond wheel is a typical ultra precision grinding process for silicon wafer.The simulation model based on the force of micro contact between wheel micro unit and silicon wafer is established from the stable ductile grinding process.Micro contact process of self rotating grinding is simulated using the analysis software LS–DYNA.The stress-strain results between silicon wafer and wheel micro unit are analyzed using finite element method.The results show that there exist critical displacements and loads of elastic-plastic and plastic-brittle transitions when processing silicon wafer.During the tangential sliding in plastic zone,plastic grooves and uplifts appear on silicon surface.Wear of wheel micro unit can be judged based on the simulation data.The research provides support for wafer grinding and wheel wear mechanism.关键词
硅片/自旋转磨削/微观接触/砂轮微单元/仿真Key words
silicon wafer/self rotating grinding/micro contact/wheel micro unit/simulation分类
矿业与冶金引用本文复制引用
任庆磊,魏昕,谢小柱,胡伟..硅片自旋转磨削中基于作用力的微观接触仿真研究[J].金刚石与磨料磨具工程,2016,36(2):19-23,5.基金项目
国家自然科学基金资助项目(U0734008) （U0734008）
广东省自然科学基金资助项目(8151009001000048) （8151009001000048）
广东工业大学校青年基金资助项目(082042)。 （082042）
