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不同密度研磨介质球对机械研磨电镀铜镀层耐蚀性能影响

方华 李晔 郭方松 姜赫

表面技术2016,Vol.45Issue(5):143-148,6.
表面技术2016,Vol.45Issue(5):143-148,6.DOI:10.16490/j.cnki.issn.1001-3660.2016.05.022

不同密度研磨介质球对机械研磨电镀铜镀层耐蚀性能影响

Effect of Grinding Media Ball with Different Densities on Corrosion Resis-tance of Mechanical Attrition Electroplated Cu Coating

方华 1李晔 1郭方松 1姜赫2

作者信息

  • 1. 东北石油大学机械科学工程学院,黑龙江大庆 163000
  • 2. 大庆师范学院机电工程学院,黑龙江大庆 163000
  • 折叠

摘要

Abstract

Objective To polish plating copper coatings by vertical impact electroplating device.MethodsGlass ball, cop-per ball and lead ball were added to acid copper plating solution. Copper plating coatings with a thickness of 30 μm were pre-pared when the swing of the vertical impact electroplating device was 4 mm and its frequency was 12 Hz. Scanning electron mi-croscopy (SEM) was used to observe the microstructure of the plating surface and study the effect of grinding media ball with different densities on unit cell size. The refinement mechanism mechanical grinding electroplating cell was studied by measuring the cathodic polarization degree in the process of mechanical polishing plating using potentiostat. The corrosion speed of plating in 3.5% NaCl solution of mass fraction was tested using gravity losing method to study the relationship between medium ball density and corrosion speed of copper plating. The relationship between medium ball density and corrosion speed of copper plating was verified employing electrochemical measurement technology.ResultsCompared with the ordinary coating, the crystal cells of mechanical polishing copper plating were smaller and the corrosion resistance was better. According to the test results, the crystal cells of mechanical polishing copper plating using lead ball were the smallest and the corrosion resistance was the best. The crystal cells of copper ball mechanical polishing copper plating and the corresponding corrosion resistance took the second place. The crystal cells of glass ball mechanical polishing copper plating were the largest and the corrosion re-sistance was the worst. ConclusionThe smaller the copper plating cell was, the better corrosion resistance was as the density of medium ball increased in certain density range (2~12.3)×103kg/m3.

关键词

机械研磨/铜镀层/介质球密度/晶胞细化/耐蚀性

Key words

mechanical polishing/Cu coating/medium ball density/unit cell refinement/corrosion resistance

分类

化学化工

引用本文复制引用

方华,李晔,郭方松,姜赫..不同密度研磨介质球对机械研磨电镀铜镀层耐蚀性能影响[J].表面技术,2016,45(5):143-148,6.

表面技术

OA北大核心CSCDCSTPCD

1001-3660

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