中国机械工程2016，Vol.27Issue(11)：1439-1445,7.DOI:10.3969/j.issn.1004-132X.2016.11.004
废旧电路板元器件分离位移模型研究
Study on Separating Displacement Models for Component from Waste Printed Circuit Board
摘要
Abstract
Under conditions of melt solder,whether components might be disassembled was de-cided by the separating distance between components and the substrate (named as separating displace-ment)caused by removal force.Firstly,the models of separating displacement for surface mount de-vices (SMD)and through-hole devices (THD)were established under the conditions of vertical disas-sembly and horizontal disassembly.Secondly,based on the Laplace equation and the Newton’s equa-tion for hydrostatic pressure,tensile breaking height of solder was analyzed and modeled in vertical disassembly for 3 typical kinds of components and the programmed algorithm was elaborated in detail. Finally,to verify the models for tensile breaking height of the melted solder,based on SMD with mounting base experiments were performed and the results show that the models for tensile breaking height are effective for melting solder.Models of separating displacements for components will be helpful to quantify the distance between components and the substrate,which is helpful for preparing the dismantling process of waste PCBs.关键词
废弃电路板/拆解/分离位移/断裂高度Key words
waste printed circuit board (PCB)/disassembly/separating displacement/tensile breaking height分类
信息技术与安全科学引用本文复制引用
向东,吴育家,杨继平,龙旦风,牟鹏..废旧电路板元器件分离位移模型研究[J].中国机械工程,2016,27(11):1439-1445,7.基金项目
国家高技术研究发展计划(863计划)资助项目(2013AA040207) （863计划）
