Researching the silicon direct wafer bonding with interfacial SiO2 layerOACSCDCSTPCD
Researching the silicon direct wafer bonding with interfacial SiO2 layer
Wang Xiaoqing;Yu Yude;Ning Jin
State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaState Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaState Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
wafer direct bondingsurface roughnessbonding strength
wafer direct bondingsurface roughnessbonding strength
《半导体学报（英文版）》 2016 (5)
121-124,4
Project supported by the Key Program of the National Natural Science Foundation of China (No.61334008) and the National Natural Science Foundation of China (No.61376072).
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