电讯技术2016，Vol.56Issue(5)：581-584,4.DOI:10.3969/j.issn.1001-893x.2016.05.018
系统级封装的S频段射频收发模块研制
Development of an S-band RF Transceiver Module with System in Package Technology
武红玉 1厉志强 1汪江涛1
作者信息
- 1. 中国电子科技集团公司第十三研究所，石家庄050051
- 折叠
摘要
Abstract
A miniaturized S-band radio frequency(RF) transceiver module is designed by using system in package( SIP) technology. The module integrates devices based on a variety of process. Receiving channel is realized by single-conversion,transmitting channel is realized by double-conversion,and the intermediate frequency( IF) and RF local oscillator( LO) signal source is integrated internally. Double-cavity structure is used and different cavities are vertically interconnected through the insulator to reduce the module size large-ly. The size of module is 40 mmí40 mmí10 mm. Forward design is used and the measured main technical specifications of the module are:receiving channel dynamic range-100~-40 dBm,output signal 0~2 dBm, noise figure ≤2. 8 dB,out-band rejection ≥50 dBc; transmitting channel output signal ≥2 dBm,second and third harmonic suppression≥60 dBc,clutter rejection≥55 dBc,phase noise≤-82 dBc/Hz@1 kHz,≤-91 dBc/Hz@10 kHz. The measured results are basically agree with the simulation results.关键词
S频段/射频收发系统/系统级封装/本振信号源/垂直互连结构Key words
S-band/RF transceiver system/system in package/local oscillator signal source/vertical inter-connection structure分类
信息技术与安全科学引用本文复制引用
武红玉,厉志强,汪江涛..系统级封装的S频段射频收发模块研制[J].电讯技术,2016,56(5):581-584,4.
