电子学报2016，Vol.44Issue(6)：1272-1278,7.DOI:10.3969/j.issn.0372-2112.2016.06.002
多处理器片上系统中一种结合二阶导数的温度预测模型
A Predictive ThermaI ModeI Co mbined with the Second Derivative for Mu Itiprocessor Syste m-on-Chips
摘要
Abstract
The regional temperature prediction is the basis of the efficient heat dissipation in multiprocessor system-on-chips (MPSoCs).Based on the thermal resistance and capacitance (Thermal RC)model,this paper proposed a predic-tive thermal model combined with the second derivative.It predicts the temperature accurately with low complexity,and in-creases the prediction time length within a certain prediction error range to reduce the number of times that the prediction module is invoked and the extra power consumption.Experimental results show that,compared to the existing model com-bined with the first derivative,the proposed model increases the prediction length by 1. 6 times within the same acceptable prediction error range.When the prediction time length is increased to 2. 5 s,the prediction accuracy of the proposed model is 3. 84% higher than that of the contrastive model.关键词
多处理器片上系统(MPSoCs)/RC热传导模型/温度预测模型Key words
multiprocessor system-on-chips (MPSoCs)/thermal resistance and capacitance (Thermal RC)model/predictive thermal model分类
信息技术与安全科学引用本文复制引用
魏琳,周磊,吴宁,杨睛..多处理器片上系统中一种结合二阶导数的温度预测模型[J].电子学报,2016,44(6):1272-1278,7.基金项目
国家自然科学基金（No．61376025，No．61301111）；江苏省高校自然科学基金（No．13KJB510039）；江苏省普通高校研究生科研实践计划项目 （）
