纳微快报（英文）2010，Vol.2Issue(2)：60-67,8.DOI:10.5101/nml.v2i2.p60-67
Reactive wetting behaviors of Sn/Cu systems：A molecular dynamics study
Reactive wetting behaviors of Sn/Cu systems：A molecular dynamics study
J Y Hsieh 1J L Chen 2C Chen 3H C Lin 4S S Yang 4C C Hwang4
作者信息
- 1. Department of Mechanical Engineering, Ming Hsin University of Science and Technology, Hsinchu 30401, Taiwan
- 2. Department of Mechanical Engineering, WuFeng Institute of Technology, Chiayi 621, Taiwan
- 3. Department of Information Management, Meiho Institute of Technology, Pingtung 912, Taiwan
- 4. Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan
- 折叠
摘要
关键词
Wetting/Surface alloying/Molecular dynamics/DropletKey words
Wetting/Surface alloying/Molecular dynamics/Droplet引用本文复制引用
J Y Hsieh,J L Chen,C Chen,H C Lin,S S Yang,C C Hwang..Reactive wetting behaviors of Sn/Cu systems：A molecular dynamics study[J].纳微快报（英文）,2010,2(2):60-67,8.
