Finite element analysis of expansion-matched submounts for high-power laser diodes packagingOACSCDCSTPCDEI
Finite element analysis of expansion-matched submounts for high-power laser diodes packaging
Ni Yuxi;Ma Xiaoyu;Jing Hongqi;Liu Suping
National Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, ChinaNational Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, ChinaNational Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, ChinaNational Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, China
high-power laser diodescoefficient of thermal expansionthermal managementfinite element analysis
high-power laser diodescoefficient of thermal expansionthermal managementfinite element analysis
《半导体学报（英文版）》 2016 (6)
72-76,5
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