摘要
Abstract
Aimed at the multilayer structure being unable to parse,the thermodynamics distributing model has been put forward by revising bimetal strip stresses model advanced by Suhir. E,which applies to evaluate the thermal stress distributing rule of MEMS multilayer structure. Under the thermal loading,multilayer structure composed by different material will create normal stress,shearing stress and peeling stress,and the stress variety concentre in the end of interface. Normal stress distributes in each layer,which value presents exponential decrease along with the distance from centre of each layer,and decreases sharply in the end until achieve minimum. Shearing stress and peeling stress main distribute in the interface of each layer,both values present exponential increate along with the distance from centre of bonded pair,and increase sharply in the end until achieve maximum. Then,the thermody⁃namic simulation has been analyzed on multilayer structure composed by four material such as glass,chromium,cu⁃prum and nickel,which result validate the analytic model and the stress distributing in multilayer structure.关键词
MEMS/多层薄膜结构/热应力/温度载荷Key words
mems/multilayer structure/thermal stress/temperature load分类
信息技术与安全科学
