浅谈大功率LED封装工艺设计及优化OA
Design and Optimization of High-Power LED Packaging Technology
大功率LED在节能和亮度方面的突出优势，得到了越来越的运用，如广场、草坪等环境。本文通过阐释大功率LED封装工艺的设计流程、重点参数、封装工艺等，分析了优化环节与措施，旨在为大功率LED的生产提供理论依据。
The outstanding advantage of High power LED is energy saving and brightness. High power LED is used more and more widely, such as squares, lawns and other environments.This paper describes the design of high-power LED packaging process, focus parameters, packaging technology,etc.,which provide a theoretical basis for the production of high-power LED based on Analysis and optimization measures.
刘勇求;严其艳
广东科技学院，广东东莞，523083广东科技学院，广东东莞，523083
土木建筑
大功率LED封装工艺设计优化
High Power LEDPackaging ProcessDesign Optimization
《工业技术创新》 2016 (3)
514-517,4
2014年广东省普通高校青年创新人才项目（2014KQNCX245）。
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