表面技术2016，Vol.45Issue(7)：8-16,9.DOI:10.16490/j.cnki.issn.1001-3660.2016.07.002
氯离子浓度对Ni-P合金涂层失效过程影响的SECM实验和COMSOL模拟研究
The Effect of Chloride Ion on Corrosion Behavior of Ni-P Alloy Coating Using SECM Experiment and COMSOL Simulation
摘要
Abstract
ABSTRACT:Objective To develop corrosion electrochemistry method with spatial resolution.Methods Pure Ni and Ni-P alloy coatings on copper substrates were fabricated by electrodeposition. Scanning Electron Microscopy (SEM) and XRD were applied to check surface morphology and crystal structure of the alloy coatings. Scanning Electrochemical Microscopy (SECM) research was applied to monitor the failure behavior of typical Ni and Ni-P coating in different concentration of NaCl solution. Combined with COMSOL Multiphysics simulation, 2D and 3D models were built to quantify activity point size and feedback mechanism.Results The low concentration of chloride ion had the activation effect for pure Ni coating, while higher chloride ion concentration promoted corrosion occurrence. Ni-P alloy coating maintained good stability in a short immersion time in low concentration of chloride in the solution. After 6 hours soaking, there were typical active points and corrosion products for low P alloy coating, while after 24 hours soaking for high P alloy coating. The corrosion type for low P alloy coating in 0.1 mol/L NaCl solution was localized corrosion and uniform corrosion in 0.3 mol/L NaCl solution. The simulation results of approaching curve showed that the electrochemical process of corrosion products for FcMeOH was completely inert and fresh Cu surface was electrochemical activity. 3D simulation results showed that active points of Ni-P coating failure process were close to 10 micron. Conclusion The failure process including the formation of active points, the generation and accumulation of corrosion production of Ni and Ni-P coating in NaCl solution is dependent on the positive and/or negative feedback effect of SECM map-ping. Chloride ion promotes occurrence of corrosion process, and its concentration has a strong effect on the corrosion type for Ni-P coating. COMSOL multiphysics simulation results indicate that the feedback effect is strongly dependent on the distance between the tip and the substrate, and the size of active point for Ni-P coating is micron level.关键词
Ni-P合金涂层/SECM/COMSOL模拟/活性点/分辨率Key words
Ni-P coating/SECM/COMSOL simulation/active site/resolution分类
矿业与冶金引用本文复制引用
周亚茹,朱泽洁,聂林林,张鉴清,曹发和..氯离子浓度对Ni-P合金涂层失效过程影响的SECM实验和COMSOL模拟研究[J].表面技术,2016,45(7):8-16,9.基金项目
国家自然科学基金项目（51171172，51131005）；浙江省自然科学基金杰出青年项目（LR16E010001）；中央高校基本研究经费（2015QNA3011） FundSupported by National Natural Science Foundation of China (51171172 and 51131005) （51171172 and 51131005）
Zhejiang Province Natural Science Foundation of China (LR16E010001) and Fundamental Research Funds for the Central Universities (2015QNA3011) （LR16E010001）
