发光学报2016，Vol.37Issue(9)：1159-1165,7.DOI:10.3788/fgxb20163709.1159
纳米银焊膏烧结大功率LED模块的高温可靠性研究
High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste
摘要
Abstract
A general procedure for accelerated degradation testing ( ADT) was presented to predict the lifetime of three kinds of LED modules. The die attach materials of LED modules were nano-sil-ver paste, Sn3Ag0. 5Cu (Sn-based alloys), silver epoxy, respectively. The ambient temperature and forward current were controlled, and the light output at several time points was measured. The degradation mechanism of LEDs modules was analyzed. The lifetimes of LED modules under the condition of different die attach materials were predicted. The test results show that the nano-silver paste is a very promising die-attach material for the aging of multi-chip high power LED modules.关键词
大功率LED模块/粘结材料/纳米银焊膏/加速老化试验/寿命Key words
high power LED module/die attach materials/nano-silver paste/accelerated degradation testing/lifetime分类
信息技术与安全科学引用本文复制引用
陈佳,李欣,孔亚飞,梅云辉,陆国权..纳米银焊膏烧结大功率LED模块的高温可靠性研究[J].发光学报,2016,37(9):1159-1165,7.基金项目
天津市自然科学基金青年基金(13JCQNJC02400)资助项目 （13JCQNJC02400）
