东南大学学报（自然科学版）2016，Vol.46Issue(5)：928-933,6.DOI:10.3969/j.issn.1001-0505.2016.05.005
高功率单相桥模块封装热特性研究及优化
Investigation and optimization of thermal characteristics for high power single phase bridge module
摘要
Abstract
In order to improve the thermal reliability of single phase bridge module for high power applications,the thermal characteristics of the module are investigated by using finite elements simu-lation and analysis methods.The accuracy and reliability of simulation analysis are verified by com-paring with the measured results.The results show that the junction-to-case thermal resistance of the power module is 0.185 3 ℃/W,while the insulated ceramic layer of direct bonding copper (DBC) among the 7-layer structure of the module package occupies 52.12% of it.The solution replacing the initial ceramic layer by the higher thermal conductivity materials can reduce the junction-to-case thermal resistance effectively.Moreover,the parasitic joule heat induced by power terminals and bonding wires will further increase the junction temperature and make the module suffer from more degradation.The influences of different power terminals and bonding wires on the thermal character-istics of the module are analyzed specifically.Both adopting copper pillar power terminals and enlar-ging the density or cross sectional areas of bonding wires near the terminal side(high current density region)can reduce junction temperature.As a result,the thermal reliability and current capability of single phase bridge power module can be improved.关键词
单相桥模块/高功率/热阻/功率端子/引线Key words
single phase bridge module/high power/thermal resistance/power terminals/bonding wires分类
通用工业技术引用本文复制引用
王宁,宋海洋,魏家行,刘斯扬,孙伟锋,朱久桃,余传武,朱袁正..高功率单相桥模块封装热特性研究及优化[J].东南大学学报（自然科学版）,2016,46(5):928-933,6.基金项目
港澳台国际合作计划资助项目（2014DFH10190）、中国博士后基金资助项目（2015M580376）、江苏省博士后科研资助计划资助项目（1501010A）． （）
