传感技术学报2016，Vol.29Issue(10)：1516-1521,6.DOI:10.3969/j.issn.1004-1699.2016.10.009
基于阳极氧化铝基板的圆片级板载芯片封装技术
A Wafer Level Chip on Board Package Based on Anodic Alumina Substrate
摘要
Abstract
A novel chip on board(COB)technology based on thin anodic alumina substrate is proposed. The 0.1mm thickness anodic alumina substrate is developed by oxalic anodized method with 60 V voltage and 30℃tempera⁃ture,and the line width,resistance of Al interconnect and insulation resistance between Al interconnects are 35μm,below 1Ω/cm and over 1×1010Ω,respectively. The wafer-level COB wafer,which includes an anodic alumina wafer and flash chips,is achieved by chip-on-chip SMT,and the yield is over 93%. Finally,a NAND Flash module has been developed. Furthermore,the COB package technology based on anodic alumina substrate has a wide appli⁃cation prospect.关键词
三维封装/板载芯片/阳极氧化铝/封装基板Key words
3D package/COB/anodic alumina/packaging substrate分类
信息技术与安全科学引用本文复制引用
刘米丰,吴伟伟,任卫朋,王立春..基于阳极氧化铝基板的圆片级板载芯片封装技术[J].传感技术学报,2016,29(10):1516-1521,6.基金项目
国家科技重大专项项目 （）
