机电工程技术2016，Vol.45Issue(10)：80-84,5.DOI:10.3969/j.issn.1009-9492.2016.10.021
电子连接器温升仿真分析
Temperature Rise Simulation of Electronic Connector
摘要
Abstract
Base on the complex surface features of electronic connector components,this paper proposed that considered the surface heat transfer coefficient as unknown, used the finite volume method of CFD to solve the connector on the temperature rise, an electronic connector case analysis using ICEPAK software simulation, supplemented by Q3D Extractor to calculate the volume resistance of connector terminals,finally carried on a temperature rise test to verify this simulation method.关键词
连接器/温升/ICEPAK/仿真分析Key words
connector/temperature rise/ICEPAK/simulation分类
信息技术与安全科学引用本文复制引用
杨志坚,郑泰山,余宁,蔡川..电子连接器温升仿真分析[J].机电工程技术,2016,45(10):80-84,5.基金项目
广东省省级科技计划项目 （）
