上海有色金属2016，Vol.37Issue(4)：155-160,6.DOI:10.13258/j.cnki.nmme.2016.04.006
摩擦化学反应活化能对 CMP 的影响
Effect of Friction Chemical Reaction Activation Energy on CMP Process
卜小峰1
作者信息
- 1. 东莞市慕思寝室用品有限公司，广东 东莞 523498
- 折叠
摘要
Abstract
According to the law of mass action,the reaction rate constants of copper film chemical reaction are measured under static corrosion and dynamic chemical mechanical polishing (CMP) process.The activation energy of copper film chemical reaction is acquired under the two kinds of reaction conditions above mentioned based on the Arrhenius equation.The results show that:as the slurry temperature is 298.15 K with working pressure 13 780 Pa during the CMP process,and the chemicalreaction rate constant of the system under the static corrosion condition is 114.80 s-1 ,and the reaction activation energy is 31 870.30 J,while the reaction rate constant increases to 412.11 s-1 and reaction activation energy decreases to 4 849.80 J under the CMP condition.Thus,the mechanical friction effect in the CMP process causes the decline of activation energy as a result.Therefore, according to the system power produced by the sliding friction between the copper film and the polishing pad in the CMP process,system power expression used for describing the decline of activation energy in the CMP process is calculated.And also the applicability of the expression has been verified by changing the work pressure and speed of the CMP process.关键词
质量作用定律/Arrhenius 方程/化学反应/活化能/机械摩擦作用Key words
law of mass action/Arrhenius equation/chemical reaction/activation energy/mechanical friction effect分类
化学化工引用本文复制引用
卜小峰..摩擦化学反应活化能对 CMP 的影响[J].上海有色金属,2016,37(4):155-160,6.
