现代电子技术2016，Vol.39Issue(20)：20-23,26,5.DOI:10.16652/j.issn.1004-373x.2016.20.006
LED散热问题分析与应对方法研究
Analysis and coping approach of LED heat dissipation problem
摘要
Abstract
LED as a new generation of green environmental protection,low carbon,energy⁃saving solid⁃state lighting light source is more and more widely used in the field of lighting,but high power LED such as automobile headlamp has only about 30% of the input power to be transformed into light and the rest is changed into heat energy,which makes the LED chip temper⁃ature increased,influences the chip performance greatly,causes reduction of chip emission photons and light output,seriously affects the fluorescence powder characteristic caused by wavelength shift,results in a reduction of the color purity due to the de⁃crease of color temperature quality,and finally accelerates the aging of the LED chip and shortens the service life of the whole device. This problem has restricted the popularization of LED in the automotive lighting. In this paper,the chip packaging mate⁃rial(substrate)and the arrangement of chips are researched to find out the optimal heat radiation scheme.关键词
发光二极管/高温影响/节能型固体照明/汽车前照灯Key words
light emitting diode/high temperature/energy-saving solid-state lighting/automotive headlamp分类
信息技术与安全科学引用本文复制引用
魏海红,郭献洲..LED散热问题分析与应对方法研究[J].现代电子技术,2016,39(20):20-23,26,5.基金项目
国家自然科学基金高维全纯丛的相似分类 （）
