大功率变流技术Issue(5)：36-40,74,6.DOI:10.13889/j.issn.2095-3631.2016.05.007
全烧结型SiC功率模块封装设计与研制
Packaging Consideration and Development for Fully Sintered SiC Power Module
摘要
Abstract
Aiming to meet the requirements for high reliability and operating temperature of-60 ℃ to 200 ℃,it investigated an advanced packaging design for developing a SiC-based planar power module with fully sintering technologies.The key features of the SiC power module result from the wire-less,baseplate-less,fully-sintered,compact half-bridge power switch module.The packaging considerations and flexible PCB with low parasitic inductance in this SiC-based power module were discussed.In order to improve the reliabilities and operating temperature,the low temperature sintering technology of Ag nanoparticles was selected as the alternative joining technology for assembling the designed power modules that accommodated SiC JFETs and SiC Schottky diodes.The preliminary experiment demonstrates that the designed power module with fully Ag sintering technology can achieve the electrical function of switching-on and switching-off.关键词
碳化硅/功率模块/封装设计/低温银烧结/低电感Key words
SiC/power module/packaging design/low temperature silver sintering/low stray inductance分类
信息技术与安全科学引用本文复制引用
戴小平,吴义伯,赵义敏,王彦刚..全烧结型SiC功率模块封装设计与研制[J].大功率变流技术,2016,(5):36-40,74,6.基金项目
European CleanSky MatPlan Project (No:304851) （No:304851）
