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LTCC层压工艺对垂直互联柱错位的影响

罗天宏 廖志平 周德俭

桂林电子科技大学学报2016,Vol.36Issue(5):421-425,5.
桂林电子科技大学学报2016,Vol.36Issue(5):421-425,5.

LTCC层压工艺对垂直互联柱错位的影响

Impact of LTCC laminating process on vertical interconnection column misalignment

罗天宏 1廖志平 1周德俭1

作者信息

  • 1. 桂林电子科技大学 机电工程学院,广西 桂林 541004
  • 折叠

摘要

Abstract

During LTCC laminating process,the vertical interconnection column will generate misalignment.A three-dimen-sional model of LTCC microwave component is established by finite element software ANSYS,and the influence of LTCC laminating process on vertical interconnection column misalignment is studied.The results show that during LTCC lamina-ting process,the viscous deformation on material eventually leads to vertical interconnection column misalignment.Pressure is the main factor that leads to the misalignment of vertical interconnection column.Laminating process parameters are com-bined by pressure of 10 MPa,temperature of 50 ℃,time of 6 min and diameter of 0.26 mm,the vertical interconnection column misalignment is 1 .39%.

关键词

LTCC/层压工艺/垂直互联柱/错位

Key words

LTCC/laminating process/vertical interconnection column/misalignment

分类

信息技术与安全科学

引用本文复制引用

罗天宏,廖志平,周德俭..LTCC层压工艺对垂直互联柱错位的影响[J].桂林电子科技大学学报,2016,36(5):421-425,5.

基金项目

国防 973 项目"多能量***研究" ()

桂林电子科技大学学报

1673-808X

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