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首页|期刊导航|半导体学报(英文版)|Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices

Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices

He Baoping Wang Zujun Sheng Jiangkun Huang Shaoyan

半导体学报(英文版)2016,Vol.37Issue(12):45-50,6.
半导体学报(英文版)2016,Vol.37Issue(12):45-50,6.DOI:10.1088/1674-4926/37/12/124003

Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices

Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices

He Baoping 1Wang Zujun 1Sheng Jiangkun 1Huang Shaoyan1

作者信息

  • 1. The State Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology,Xi'an 710024, China
  • 折叠

摘要

关键词

total ionizing dose (TID)/ bulk CMOS/ shallow trench isolation (STI)/ oxide trapped charge/ interface traps

Key words

total ionizing dose (TID)/ bulk CMOS/ shallow trench isolation (STI)/ oxide trapped charge/ interface traps

引用本文复制引用

He Baoping,Wang Zujun,Sheng Jiangkun,Huang Shaoyan..Total ionizing dose radiation effects on NMOS parasitic transistors in advanced bulk CMOS technology devices[J].半导体学报(英文版),2016,37(12):45-50,6.

基金项目

Project supported by the National Natural Science Foundation of China (No.11305126). (No.11305126)

半导体学报(英文版)

OACSCDCSTPCDEI

1674-4926

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