华中科技大学学报（自然科学版）2017，Vol.42Issue(2)：55-60,6.DOI:10.13245/j.hust.170211
电极形状对介电泳抛光影响的仿真研究
Simulation and experimental study on influence of electrode geometry on dielectrophoresis polishing
摘要
Abstract
To solve the problem of improving the accuracy and efficiency of in flat polishing,dielectro-phoresis polishing (DEPP)was proposed,based on the dielectrophoretic effect of neutral particle in a non-uniform electric field.The theory of dielectrophoresis and DEPP principle were described.The distribution of electric field lines with different electrodes was simulated and analyzed by COMSOL. The results show that the distribution of electric field lines of the ring 70~90 mm electrode is the most non-uniform.The DEPP experiments of the corresponding electrodes were carried out.The re-sults show that,when the ring 70~90 mm electrode used,the material removal rate is the highest, and which is 0.573 mg/min,up to 19.9% compared to the traditional chemical mechanical polishing (CMP).Surface uniformity of silicon wafer is the best when the circularΦ60 mm electrode used,and polishing efficiency is the highest.AΦ76.2 mm silicon wafer can be polished as mirror effect in 2.5 hours,improved 3.6 times than the traditional CMP.In practical DEPP,the circularΦ60 mm elec-trode is the most suitable for theΦ7 6 .2 mm silicon wafer.关键词
介电泳/抛光/电极形状/效率/均匀性/仿真研究Key words
dielectrophoresis/polishing/electrode geometry/efficiency/uniformity/simulation re-search分类
信息技术与安全科学引用本文复制引用
赵天晨,袁巨龙,邓乾发,杭伟..电极形状对介电泳抛光影响的仿真研究[J].华中科技大学学报（自然科学版）,2017,42(2):55-60,6.基金项目
国家自然科学基金资助项目(51275746,51275272) （51275746,51275272）
浙江省自然科学基金资助项目(LY15E050022, LY17E050022) （LY15E050022, LY17E050022）
浙江省科技创新团队资助项目(2011R50011-06) （2011R50011-06）
