高校化学工程学报2017，Vol.31Issue(1)：197-204,8.DOI:10.3969/j.issn.1003-9015.2017.01.028
DMP-30对环氧/马来酸酐固化行为的影响
Effects of DMP-30 on Curing Behavior of Epoxy Resin/Maleicanhydride Systems
黄超 1葛震 1赵本波 1王真 1罗运军1
作者信息
- 1. 北京理工大学材料学院,北京 100081
- 折叠
摘要
Abstract
The curing process and kinetics of tris (dimethylaminomethyl)phenol(DMP-30)/epoxy resin(E-51)/maleic anhydride(MA) systems were investigated by DSC using a non-isothermal method under different heating-up rates. The apparent activation energy of the curing system was calculated by Kissinger method and Ozawa method respectively, and the reaction was classified by Crane formula. Moreover, the optimized curing process was analyzed by DSC, and the curing behavior of the curing system with 2% (wt) DMP-30 was predicted. The results indicate that the apparent activation energy and reaction temperature of DMP-30/E-51/MA systems decrease with the increase of DMP-30, and the curing process of the curing reactions follows the first order reaction. The addition of DMP-30 does not change epoxy resin curing mechanism. DSC data shows that the optimized curing process of the curing systems is℃℃℃90/2h→120/2h→130/1h. The curing behavior of the curing system with 2% (wt) DMP-30 is predicted by curing kinetics equations, which provides theoretical basis to achieve higher curing degree by raising temperature and increasing reaction time.关键词
2,4,6-三(二甲氨基甲基)/环氧树脂/固化动力学/固化特性Key words
2,4,6-tris(dimethylaminomethyl)phenol/epoxy resin/curing kinetics/curing behaviour分类
化学化工引用本文复制引用
黄超,葛震,赵本波,王真,罗运军..DMP-30对环氧/马来酸酐固化行为的影响[J].高校化学工程学报,2017,31(1):197-204,8.
