表面技术2017，Vol.46Issue(1)：36-39,4.DOI:10.16490/j.cnki.issn.1001-3660.2017.01.006
低介电聚酰亚胺/氟化石墨烯复合薄膜的制备及表征
Preparation and Characterization of Polyimide/Fluorinated Grapheme Composite Films of Low Dielectric Constant
摘要
Abstract
The work aims to solve the RC delay, signal crosstalk, power consumption, noise and other issues caused by the high integration of super-large scale integrated circuits and prepare polyimide/fluorinatedfilms of low dielectric constant. Fluo-rinated graphene solution and polyamide acid solution were prepared by simple sonochemical exfoliation method and two-step method. The PI/FG composite films were prepared by solution blending method, while microstructure and dielectric properties of FG, PI and PI/FG composite films were characterized by transmission electron microscopy (TEM), Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD) and precision impedance analyzer. The polyimide/fluorinated films were suc-cessfully prepared and the dielectric constant of composite film decreased from 3.63 to 2.52. The polyimide/fluorinated gra-pheme composite films of low dielectric constant are successfully prepared.关键词
聚酰亚胺/氟化石墨烯/介电常数/表征Key words
polyimide/fluorinated graphene/dielectric constant/characterization分类
矿业与冶金引用本文复制引用
白瑞,卢翠英,高平强..低介电聚酰亚胺/氟化石墨烯复合薄膜的制备及表征[J].表面技术,2017,46(1):36-39,4.基金项目
国家青年科学基金(51502261) Supported by the National Youth Science Foundation of China(51502261) （51502261）
