航空兵器Issue(1)：74-78,5.DOI:10.19297/j.cnki.41-1228/tj.2017.01.012
气动加热对空空导弹内部电路的温度影响分析
Analysis for Temperature Effect of Aerodynamic Heating on the Internal Circuit of the Air-to-Air Missile
杨科1
作者信息
- 1. 中国空空导弹研究院, 河南 洛阳 471009
- 折叠
摘要
Abstract
The air-to-air missile subassembly located in special position, cause the harsh operational environment.The temperature effect of the aerodynamic heating to the internal circuit is indicated by this subassembly thermal simulation calculation analysis based on FloTHERM, and the proof for the temperature rise control of the component is carried out.The simulation results show that the temperature rise of the subassembly internal circuit is delayed, and the peak time of shell temperature is the demarcation point where the internal circuit temperature rise changed rapidly, and also more remarkable while the self-flying time is longer.关键词
热设计/热仿真/气动加热Key words
thermal design/thermal simulation/aerodynamic heating分类
信息技术与安全科学引用本文复制引用
杨科..气动加热对空空导弹内部电路的温度影响分析[J].航空兵器,2017,(1):74-78,5.
