物理学报2017，Vol.66Issue(1)：254-262,9.DOI:10.7498/aps.66.016102
考虑底充胶固化过程的InSb面阵探测器结构分析模型
Structural model of InSb IRFPAs including underfill curing process
摘要
Abstract
InSb infrared focal plane array (IRFPA) detector,active in 3-5 μm range,has been widely used in military fields.Higher fracture probability appearing in InSb infrared focal plane arrays (IRFPAs) subjected to thermal shock test,restricts its final yield.In order to analyze and optimize the structure of InSb IRFPAs,it is necessary to create the three-dimensional structural model of InSb IRFPAs,which is employed to estimate its strain distribution appearing in the different fabricating processes.In this paper,the curing model of underfill is described by its volume contraction percentage combined with the elastic modulus of the completely cured underfill.Thus,both the yon Mises stress and the Z-components of strain accumulated in the curing process of underfill are calculated.When InSb IRFPAs is naturally cooled to room temperature from the curing temperature of underfill,the Z-component of strain distribution appearing on the top surface of InSb IRFPAs is obtained with our structural model,which is identical to the deformation distribution on the top surface of InSb IRFPAs measured at room temperature.In the following thermal shock simulation,we find that the maximal von Mises stress appears at 100 K and the maximal Z-component of strain appears at 150 K,these two temperature points are located in the second half of the thermal shock process,these results indicate that the fracture of InSb chip happens more easily in liquid nitrogen shock test.This inference is consistent with the fact appearing in liquid nitrogen shock test.All these findings suggest that the proposed model is suitable to estimate the deformation distribution of InSb IRFPAs and its changing rule in its different fabricating stages.关键词
焦平面/锑化铟/结构应力Key words
infrared focal plane arrays/InSb/structural stress引用本文复制引用
张晓玲,司乐飞,孟庆端,吕衍秋,司俊杰..考虑底充胶固化过程的InSb面阵探测器结构分析模型[J].物理学报,2017,66(1):254-262,9.基金项目
Project supported by the Young Scientists Fund of the National Natural Science Foundation of China (Grant No.61505048)and the Aero Science Foundation of China (Grant No.20152442001).国家自然科学基金青年科学基金(批准号:61505048)和航空科学基金(批准号:20152442001)资助的课题. （Grant No.61505048）
