液晶与显示2017，Vol.32Issue(3)：190-195,6.DOI:10.3788/YJYXS20173203.0190
LTPS工艺中光刻胶与膜层粘附力的研究
Photoresist and film adhesive force in LTPS process
剧永波 1孙宏伟 2白贺鹏 2陈建军 1张宸铭 1简月圆 1熊正平 1张龙泉 1赵东升 1罗少先 1刘昊2
作者信息
- 1. 鄂尔多斯市源盛光电有限责任公司,内蒙古 鄂尔多斯 017000
- 2. 京东方科技集团股份有限责任公司,北京 100176
- 折叠
摘要
Abstract
In this paper, four factors have been experimented and analyzed theoretically,which will influence the adhesion between photoresist and the substrate in LTPS process.It is found that the substrate material and roughness and the molecular weight distribution in the photoresist are the two most important factors that affect the adhesion between photoresist and the substrate.In terms of improving adhesion, HMDS makes better performance in improving the adhesion between strong electronegativity metal substrate and photoresist,while has obvious improvement effect in SiNX ,A-Si and P-Si substrate,and without any difference among them.But there is no improvement in ITO.Properly extending the baking time can also effectively improve the adhesion between photoresist and the substrate after the photoresist has been coated.关键词
粘附力/光刻胶/钼/钛/氧化铟锡/多晶硅/非晶硅/氮化硅Key words
adhesive force/photoresist/Mo/Ti/ITO/Poly-Si/A-Si/SiNX分类
信息技术与安全科学引用本文复制引用
剧永波,孙宏伟,白贺鹏,陈建军,张宸铭,简月圆,熊正平,张龙泉,赵东升,罗少先,刘昊..LTPS工艺中光刻胶与膜层粘附力的研究[J].液晶与显示,2017,32(3):190-195,6.
