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化学亚胺化程度对正性光敏聚酰亚胺影响

朱丹阳 金锐 吴作林 韩宝春 杨正华 张春华

应用化学2017,Vol.34Issue(3):276-281,6.
应用化学2017,Vol.34Issue(3):276-281,6.DOI:10.11944/j.issn.1000-0518.2017.03.160195

化学亚胺化程度对正性光敏聚酰亚胺影响

Effect of the Degree of Chemical Imidization on the Positive Photosensitive Polyimide

朱丹阳 1金锐 2吴作林 1韩宝春 1杨正华 1张春华1

作者信息

  • 1. 中国科学院长春应用化学研究所,高分子复合材料工程实验室 长春130022
  • 2. 全球能源互联网研究院 北京102211
  • 折叠

摘要

Abstract

Condensation polymerization of 2,2'-bis (trifluoromethyl)-4,4'-diamino biphenyl (TFDB) and 3,3',4,4'-tetracarboxydiphthalic ether dianhydride (ODPA) gives a soluble polyimide.The effect of the degree of chemical imidization on positive photosensitive polyimide performance was investigated by adjusting the content of α-picoline in the imidization reagent to control the extent of the imide.The results show that the photosensitive polyimide has the best developing performance when the mole ratio of α-picoline to acetic anhydride is 1 to 5 in the process of chemical imidization.

关键词

正性光敏聚酰亚胺/化学亚胺化/溶解性/光刻

Key words

positive photosensitive polyimide/chemical imidization/solubility/photolithography

分类

化学化工

引用本文复制引用

朱丹阳,金锐,吴作林,韩宝春,杨正华,张春华..化学亚胺化程度对正性光敏聚酰亚胺影响[J].应用化学,2017,34(3):276-281,6.

基金项目

国家电网公司科技项目:高压IGBT芯片表面钝化工艺研究(5455DW150005)Supported by the Project of the State Grid Corporation:Technology of High Voltage IGBTchip Surface Passivation(No.5455DW150005) (5455DW150005)

应用化学

OA北大核心CSCDCSTPCD

1000-0518

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