照明工程学报2017，Vol.28Issue(1)：21-29,9.DOI:10.3969∕j.issn.1004-440X.2017.01.005
高功率密度紫外LED封装模组及其光固化应用
High Power-density UV-LED Package Modules and Their Application in Curing
韩秋漪 1李思琪 1李明昊 1荆忠 2张善端1
作者信息
- 1. 复旦大学电光源研究所, 上海 200433
- 2. 上海迈芯光电科技有限公司, 上海 201612
- 折叠
摘要
Abstract
The rapid progress of ultraviolet ( UV) LED chip technology pushes UV-LEDs' application in curing field. For the purpose of meeting the requirement of industrial manufacture, high power-density UV-LED package modules are developed based on a sandwich packaging structure consisting of copper and AlN boards. The structure improves the module performances of both the thermal conduction and the current carrying. The parameters of a six-chip package module are: emitting area 0. 6 cm2 , input power 432 W, input power density 720 W · cm-2 , emittance 230 W · cm-2 , radiant efficiency 32%. This leads to the possibility of high-performance and high-power UV-LED curing systems, which have been used in wood-board-painting production lines and optical fibre drawing towers successfully. The results show more than 80% energy saving, and significant production capacity increase, which will bring revolution and opportunity to the UV curing industry.关键词
紫外LED/光固化/千瓦级功率/结温测试/辐射效率Key words
ultraviolet LEDs/photo-curing/kilowatt power/junction temperature measurement/radiant efficiency分类
信息技术与安全科学引用本文复制引用
韩秋漪,李思琪,李明昊,荆忠,张善端..高功率密度紫外LED封装模组及其光固化应用[J].照明工程学报,2017,28(1):21-29,9.
