计算技术与自动化2017，Vol.36Issue(1)：141-145,5.DOI:10.3969/j.issn.1003-6199.2017.01.028
基于紧支集双正交小波的芯片焊点定位技术研究
Research on the Positioning Technology of Chip Solder Joint Based on the Compact Support Bi-orthogonal Wavelet
摘要
Abstract
The chip packaging is the important technology to protect and enhance chip electric performance.After the chip is pasted on the lead frame,its function is realized by connecting the chip solder joint with the lead frame of a metal lead.In order to improve the accuracy of IC wire bonding and to ensure bonding machine can realize accurate positioning,the compactly supported bi-orthogonal wavelet multi-resolution analysis method was used for rapid detection and feature matching based on the edge of the chip and the substrate patch.This method can realize the accurate extraction,recognition and feature matching of the edge feature of the chip image.The algorithm can simplify the complexity of the algorithm and improve the detection efficiency and accuracy of the solder joint position.关键词
芯片封装/引线键合/小波/焊点定位Key words
IC packaging/wire bonding/wavelet/Joints location algorithm分类
信息技术与安全科学引用本文复制引用
方舟,董浩,赵晓龙..基于紧支集双正交小波的芯片焊点定位技术研究[J].计算技术与自动化,2017,36(1):141-145,5.基金项目
陕西省教育厅2014年科学研究计划专项(14JK1343) （14JK1343）
基于机器视觉的引线键合焊点快速精确定位技术 （）
