太赫兹科学与电子信息学报2017，Vol.15Issue(2)：328-332,5.DOI:10.11805/TKYDA201702.0328
倒装芯片组装集成电路开封方法
Unsealing methods of flip chip assembly integrated circuit
摘要
Abstract
The structure of flip chip assembly integrated circuit is different from conventional packaging, which brings that the current unsealing technology is not completely suitable for flip chip assembly integrated circuit. After analyzing the structures of flip chip assembly integrated circuits with different packaging forms, key factors which restrict the present unsealing technology can be found out. Taking ceramic and plastic sealed packaging flip chip assembly integrated circuits as examples, applying methods such as the heat gun, pretreatment under high temperature, mechanical stress and chemical corrosion, a set of comprehensive flip chip assembly integrated circuit unsealing technology with strong applicability and high efficiency is put forward. In addition, living examples are used for validation and conclusion. This technology caneffectively solve the unsealing problem of flip chip assembly integrated circuit and provide basis and help for the subsequent revision of the standard and the destructive physical analysis.关键词
倒装芯片/结构分析/封装形式/环氧树脂/开封方法Key words
flip chip/structural analysis/encapsulation form/epoxy resin/unsealing method分类
信息技术与安全科学引用本文复制引用
周帅,郑大勇,王斌..倒装芯片组装集成电路开封方法[J].太赫兹科学与电子信息学报,2017,15(2):328-332,5.基金项目
广东省自然科学基金资助项目(2015A030310331 （）
2015A030306002) （）
