铸造技术2016，Vol.37Issue(8)：1627-1631,5.DOI:10.16410/j.issn1000-8365.2016.08.022
集成电路高导铜合金框架材料的热处理与形变关系研究
Relationship Between Heat Treatment and Deformation of High Conductivity Copper Alloy Frame in Integrated Circuit
郭松梅 1詹跃明 1汪学2
作者信息
- 1. 重庆能源职业学院,重庆402260
- 2. 重庆大江美利信压铸有限责任公司,重庆402260
- 折叠
摘要
Abstract
Relationship between of heat treatment process and deformation of high conductive ternary copper alloy wvas studied.The results show that the optimization heat treatment process is the uniform annealing at 1 204 K for 60 min after hot rolling,and the solid solution treatment at 1 245 K for 60 min,then the rapid quenching to room temperature,hereafter,the strain proccssing of cold deformation 65％,finally,the aging treatment at 784 K for 70 min.The obtained samples after the optimization heat treatment have good mechanical properties,the conductivity can reach 87％ IACS,and the micro hardness can be as high as 189 HV.The electrical conductivity of the samples without cold deformation is about 82％ 1ACS,aud the microhardness is about 140 HV.关键词
Cu-1.0Cr-0.1Zr/热处理/冷变形/力学性能Key words
Cu-1.0Cr-0.1Zr/heat treatment/cold deformation/mechanical properties分类
矿业与冶金引用本文复制引用
郭松梅,詹跃明,汪学..集成电路高导铜合金框架材料的热处理与形变关系研究[J].铸造技术,2016,37(8):1627-1631,5.
