铸造技术2016，Vol.37Issue(9)：1838-1841,4.DOI:10.16410/j.issn1000-8365.2016.09.011
时效处理对Sn0.7Cu-0.5Al2O3/Cu焊点界面形态的影响
Effect of Aging Treatment on Interfacial Morphology of Sn0.7Cu-0.5Al2O3/Cu Solder Joint
摘要
Abstract
The effect of nano-particles Al2O3 on the wettability of Sn0.7Cu solders was investigated,and the interfacial morphology and the thickness changes of IMC on Sn0.7Cu-0.5Al2O3/Cu solder joint after aging for 0 h and 250 h were analyzed and compared.The results indicate that adding a small amount of nano-particles Al2O3 can improve the wettability of Sn0.7Cu solders;however,excessive nano-particles would reduce the spreading area.The optimum content of nano-particles Al2O3 is 0.5 wt％ for Sn0.7Cu solders,that is 30.2％ more than the spreading area of Sn0.7Cu solder.The grain size of solder joint after welding without aging was fine,and Cu6Sn5 IMC layer at the interface was thin;however,after aging at 150 ℃,the solder grains coarsen,the thickness of IMC interfacial layer increases obviously,the interfacial morphology changes from the scallop into a clear block,and the roughness of the interface decreases gradually.The interfacial layer transformes from a single Cu6Sn5 IMC layer to two layers of Cu6Sn5 IMC and Cn3Sn IMC,and the thickness is increased by 96.5％.关键词
Sn0.7Cu/Al2O3/高温时效/钎焊Key words
Sn0.7Cu/Al2O3/high temperature aging/soldering分类
矿业与冶金引用本文复制引用
邵浩彬,张宁,时孝东,朱鸣凡,於敏,殷利斌..时效处理对Sn0.7Cu-0.5Al2O3/Cu焊点界面形态的影响[J].铸造技术,2016,37(9):1838-1841,4.基金项目
国家自然科学基金青年项目(51401177) （51401177）
江苏省大型工程装备检测与控制重点建设实验室开放课题(JSKLEDC201510) （JSKLEDC201510）
徐州市科技创新专项资金项目(KC15SM041) （KC15SM041）
徐州工程学院大学生创新创业基金项目(201507) （201507）
