电焊机2017，Vol.47Issue(4)：51-55,5.DOI:10.7512/j.issn.1001-2303.2017.04.11
USB3.1 Type C超声辅助钎焊焊接性研究
Research on weldability of ultrasonic-assisted soldering on USB3.1 Type C connector
摘要
Abstract
In this paper,customed SnXX lead-free solder was used instead of SnBi solder which was normally used in the electronic packaging production.The advantages of the new ultrasonic-assisted soldering (UAS) technology in the data line connection field were illustrated through comparing the joints structure of copper wire and copper terminal in USB3.1 Type C by UAS and conventional soldering.After soldering,the joints of PIN position were full filled with solder.There were no solder pastes in the front of the PIN position,and the joints interface did not generate too many solder beads.The macroscopic morphology of the cross section appeared a smooth hemispheroid,with a fine bonding interface and no macroscopic defects.And so the product yield was highly increased.The metallurgical reaction occurred on the interface of the UAS joints,where Cu6Sn5 compounds mainly formed.关键词
USB3.1 Type C/SnXX钎料/超声辅助钎焊/组织形貌Key words
USB3.1 Type C/SnXX solder/ultrasonic assisted soldering/microstructure分类
矿业与冶金引用本文复制引用
赖志伟,许庆仁,舒胜辉,曾志,范涛,魏晶慧..USB3.1 Type C超声辅助钎焊焊接性研究[J].电焊机,2017,47(4):51-55,5.基金项目
国家自然科学基金(51205047) （51205047）
广东省省级科技计划(2014A090906005,2016A010102002) （2014A090906005,2016A010102002）
