西华大学学报（自然科学版）2017，Vol.36Issue(3)：65-68,77,5.DOI:10.3969/j.issn.1673-159X.2017.03.011
基于Moldflow的手机后盖注塑成型模拟分析与优化
Simulation Analysis and Optimization of Injection Molding of Mobile Phone Back Cover Based on Moldflow
王敏 1张钰清 2杨晓帅 2张普 2陈阳 2谢光强2
作者信息
- 1. 西南科技大学工程技术中心,四川绵阳621010
- 2. 西南科技大学“智能机器人”创新实践班,四川绵阳621010
- 折叠
摘要
Abstract
CAD three-dimensional model of mobile phone back cover is obtained by Pro/E software.By using Moldflow software,"flow + cooling + warp" injection molding is simulated for the finite element model of the product.According to the best parameter combination of the quality (molding window) analysis,the injection molding process parameters were optimized and a new injection molding simulation was completed,then the different aspects of the injection products were synthetically compared,such as fill time,weld mark,average temperature,warp deformation.At last,reasonable injection molding process parameters were determined,and quality defects that may occur were improved in the process of injection molding,and the development cycle of injection molding products was effectively reduced.关键词
手机后盖/Moldflow/注塑成型/模拟分析/优化Key words
mobile phone back cover/Moldflow/injection molding/simulation analysis/optimization分类
信息技术与安全科学引用本文复制引用
王敏,张钰清,杨晓帅,张普,陈阳,谢光强..基于Moldflow的手机后盖注塑成型模拟分析与优化[J].西华大学学报（自然科学版）,2017,36(3):65-68,77,5.
