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耐高温动态压力传感器与实验分析研究

热合曼·艾比布力 王鸿雁 薛方正 黄琳雅 皇咪咪 于明智 赵立波

实验流体力学2017,Vol.31Issue(2):44-50,7.
实验流体力学2017,Vol.31Issue(2):44-50,7.DOI:10.11729/syltlx20170028

耐高温动态压力传感器与实验分析研究

High temperature dynamic pressure sensor and experimental analysis

热合曼·艾比布力 1王鸿雁 2薛方正 3黄琳雅 4皇咪咪 4于明智 4赵立波4

作者信息

  • 1. 新疆交通职业技术学院 汽车与机电工程学院,乌鲁木齐 831401
  • 2. 陕西省计量科学研究院,西安 710065
  • 3. 西北核技术研究所,西安 710024
  • 4. 西安交通大学 机械制造系统工程国家重点实验室,微纳制造与测试技术国际合作联合实验室,苏州纳米科技协同创新中心,西安 710049
  • 折叠

摘要

Abstract

The inverted cup-type high-temperature piezoresistive pressure sensitive chip with the range of 25MPa was developed by the Micro Electro-Mechanical Systems (MEMS) and Silicon on Insulator (SOI) technology.The sensitive piezoresistors are isolated from the silicon substrate by the silicon dioxide, and thus the stability and reliability problems of the pressure sensitive chip are solved at high temperatures beyond 120℃.The flush-type mechanical packaging structure was designed to avoid the channeling effect and improve the dynamic response frequency of the sensor.For the fabricated high temperature dynamic pressure sensor, the static and dynamic performance experiments were carried out to obtain the sensor's fundamental performance and analyze its uncertainty at the static experimental temperature of 250℃.The results show that the sensor accuracy is ±0.114%FS and the uncertainty is 0.017 94mV.The thermal zero drift and thermal sensitivity drift were calculated.The dynamic response frequency was calculated as 555.6 kHz through dynamic performance experiment.Therefore, the developed MEMS pressure sensor has fine accuracy and high natural frequency at high temperatures.

关键词

MEMS/SOI倒杯式力敏芯片/齐平式/高频响/不确定度

Key words

MEMS/SOI inverted cup-type sensitive chip/flush-type/high frequency/uncertainty

分类

信息技术与安全科学

引用本文复制引用

热合曼·艾比布力,王鸿雁,薛方正,黄琳雅,皇咪咪,于明智,赵立波..耐高温动态压力传感器与实验分析研究[J].实验流体力学,2017,31(2):44-50,7.

基金项目

国家自然科学基金(51375378) (51375378)

国家重点研发计划(2016YFB1200103-04) (2016YFB1200103-04)

2016年度留学人员科技活动择优资助项目 ()

实验流体力学

OA北大核心CSCDCSTPCD

1672-9897

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