光学精密工程2017，Vol.25Issue(5)：1178-1184,7.DOI:10.3788/OPE.20172505.1178
均匀光强分布的5 kW半导体激光硬化光源研制
Development of 5 kW diode laser hardening source with homogenized intensity distribution
摘要
Abstract
With the improvement of self output power and conversion efficiency, semiconductor lasers have been widely used in laser processing field.Aiming at current requirement for hardening light source of semiconductor laser in laser processing field, a continuous output hardening light source of semiconductor laser with a wavelength of 976 mm was developed.The light source reached higher beam combination efficiency by adopting space / polarization beam combination technique, and better homogenized inherent light intensity fluctuation along slow axis for laser bar by adopting array division of cylindrical micro lens combined with focusing lens, thus making light intensity of focus spots flatly distributed.Finally, the light source was adjusted and tested experimentally.The results show that when the working current is 93 A, the maximum output power of the light source is 5 120 W, the electro-optical conversion efficiency reaches 47%, the spot size is 2 mm×16 mm and the flatness of the spot distribution is over 90%, which meet the requirement for large-scale high efficiency laser hardening in industry.关键词
激光加工/高功率半导体激光器/激光光源/激光硬化/合束Key words
laser processing/high power diode laser/laser source/laser hardening/beam combination分类
信息技术与安全科学引用本文复制引用
林星辰,朱洪波,王彪,张亚维,周成林,宁永强,王立军..均匀光强分布的5 kW半导体激光硬化光源研制[J].光学精密工程,2017,25(5):1178-1184,7.基金项目
国家自然科学基金资助项目(No.61306059,No.61674149) （No.61306059,No.61674149）
