北华大学学报（自然科学版）2017，Vol.18Issue(2)：277-280,4.DOI:10.11713/j.issn.1009-4822.2017.02.030
电热式化学镀铜地热地板的表面化学结构与导热性
Surface Chemical Structure and Thermal Conductivity of Electrothermal Electroless Copper Plating Geothermal Floor
摘要
Abstract
In order to provide references for electroless copper plating geothermal floor multilayer composites(ECPF) in practical applications,surface chemical structure of electroless copper plating poplar veneer(ECPV) and thermal conductivity of multilayer composites of ECPV were studied by X-ray photoelectron spectroscopy and laser thermal conductivity tester.The results were as follows:the Cu element of ECPV has a positive correlation with the thermal conductivity of the composite geothermal floor.The Cu element is present in the form of Cu2+ in copper coating.The dismutase reaction of Cu+ is more complete,CuOH and Cu2O gradually reduced to metal Cu with the increase of plating time.The thermal conductivity of ECPF is 2 times higher than that of ECPV,and the thermal conductivity increases with the increase of plating time in the same moisture content.关键词
化学镀/地热地板/表面化学结构/导热性Key words
electroless copper plating/geothermal floor/surface chemical structure/thermal conductivity分类
化学化工引用本文复制引用
秦静,陈丽杰,沈德君..电热式化学镀铜地热地板的表面化学结构与导热性[J].北华大学学报（自然科学版）,2017,18(2):277-280,4.基金项目
国家自然科学基金项目(31270589) （31270589）
吉林省科技发展计划项目(20140204005SF) （20140204005SF）
吉林省教育厅科学技术研究项目(2015163). （2015163）
