摘要
Abstract
Nowadays,the development trend of power electronic devices is high power and ultra-high frequency,and so heat dissipation becomes a key technical problem.In this paper,commonly used and prospective high thermal conductivity materials with ceramic matrix and metal matrix are introduced and evaluated.In particular,their advantages and disadvantages in practical application are pointed out.关键词
功率电子器件/高热导率/封接/封装Key words
Power electronic device/High thermal conductivity/Sealing/Package分类
信息技术与安全科学
