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A case study of 3 D RTM-TTI algorithm on multicore and many-core platforms

Zhang Xiuxia Tan Guangming Chen Mingyu Yao Erlin

高技术通讯（英文版）2017，Vol.23Issue(2)：185-190,6.

高技术通讯（英文版）2017，Vol.23Issue(2)：185-190,6.DOI:10.3772/j.issn.1006-6748.2017.02.010

A case study of 3 D RTM-TTI algorithm on multicore and many-core platforms

Zhang Xiuxia ¹Tan Guangming ²Chen Mingyu ¹Yao Erlin¹

作者信息

1. State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100190, P.R.China
2. University of Chinese Academy of Sciences, Beijing 100049, P.R.China
折叠

摘要

关键词

3D RTM-TTI/Intel Xeon Phi/NVIDIA K20 GPU/stencil computing/many-core/multicore/seismic imaging

Key words

3D RTM-TTI/Intel Xeon Phi/NVIDIA K20 GPU/stencil computing/many-core/multicore/seismic imaging

引用本文复制引用

Zhang Xiuxia,Tan Guangming,Chen Mingyu,Yao Erlin..A case study of 3 D RTM-TTI algorithm on multicore and many-core platforms[J].高技术通讯（英文版）,2017,23(2):185-190,6.

基金项目

Supported by the National Natural Science Foundation of China (No.61432018). （No.61432018）

高技术通讯（英文版）

ISSN：1006-6748

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