表面技术2017，Vol.46Issue(7)：70-76,7.DOI:10.16490/j.cnki.issn.1001-3660.2017.07.012
热障涂层陶瓷层/TGO界面开裂行为的有限元模拟
Finite Element Simulation of Ceramic Layer/TGO Interfacial Crack on Thermal Barrier Coating
摘要
Abstract
The work aims to better understand failure behavior of thermal barrier coating in thermal cycles. Interfacial crack behavior of thermal barrier coating during multiple thermal cycles was studied by introducing cohesive zone model in finite element method. And the effects of ceramic layer thickness and bonding layer thickness on interfacial crack behavior were taken into consideration as well. Crack was first present between crest and trough of ceramic layer/TGO layer interface. Crack was present in trough of the interface. Both average crack length and density increased as the ceramic layer thickness increased as the ceramic layer thickness ranged from 300μm to 500μm. The average crack length was 15μm when the bonding layer was 50μm thick; it decreased to 10μm when the bonding layer was 100μm thick; and increased to 12μm when the bonding layer was 150μm thick. The maximum tension stress on ceramic layer/TGO layer interface was the minimum when thickness ratio of the ceramic layer and bonding layer ranged from 0.2 to 0.4, hence the thermal barrier coating had better interfacial crack resistance. The interfacial crack behavior is greatly affected by thickness of ceramic layer and bonding layer, and the interfacial crack resis-tance will be reduced when the bonding layer is too thick. The calculation results are close that those reported in the literatures, which confirms the accuracy of simulation results.关键词
热障涂层/界面开裂/层厚比/TGO/应力/有限元模拟Key words
thermal barrier coating/interfacial crack/layer thickness ratio/TGO/stress/finite element simulation分类
矿业与冶金引用本文复制引用
刘洲庠,于金鑫,李强..热障涂层陶瓷层/TGO界面开裂行为的有限元模拟[J].表面技术,2017,46(7):70-76,7.
