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计及焊层疲劳影响的风电变流器IGBT模块热分析及改进热网络模型

李辉 胡姚刚 刘盛权 李洋 刘志祥

电工技术学报2017,Vol.32Issue(13):80-87,8.
电工技术学报2017,Vol.32Issue(13):80-87,8.DOI:10.19595/j.cnki.1000-6753.tces.151503

计及焊层疲劳影响的风电变流器IGBT模块热分析及改进热网络模型

Thermal Analysis and Improved Thermal Network Model of IGBT Module for Wind Power Converter Considering Solder Fatigue Effects

李辉 1胡姚刚 1刘盛权 2李洋 1刘志祥3

作者信息

  • 1. 输配电装备及系统安全与新技术国家重点实验室(重庆大学) 重庆 400044
  • 2. 国网江西省电力公司赣州供电分公司 赣州 341000
  • 3. 重庆科凯前卫风电设备有限责任公司 重庆 401121
  • 折叠

摘要

Abstract

Due to the influences of different fatigue lifetime stages on the junction temperature of the insulated gate bipolar transistor (IGBT) module in wind power converter, this paper analyzes the thermal resistance characteristics in different solder desquamating degrees, and then presents an improved thermal network model of the IGBT module. First, based on the structures and material parameters of the IGBT module of wind power converters, the coupling thermal-structure 3D finite element fatigue model of IGBT module is established. The junction temperature and thermal stress of IGBT module are investigated in different desquamating degrees of base plate solder and chip solder. Second, the thermal resistance parameters are determined in different desquamating degrees, and the improved thermal network model considering solder fatigue effects is established. Finally, the results of junction temperature calculated by the improved thermal network model are compared with those by the 3D finite element fatigue model, which testify the effectiveness of the improved thermal network model.

关键词

风电变流器/IGBT模块/焊层脱落/结温计算

Key words

Wind power converter/insulated gate bipolar transistor module/solder desquamation/junction temperature calculation

分类

信息技术与安全科学

引用本文复制引用

李辉,胡姚刚,刘盛权,李洋,刘志祥..计及焊层疲劳影响的风电变流器IGBT模块热分析及改进热网络模型[J].电工技术学报,2017,32(13):80-87,8.

基金项目

国家自然科学基金(51377184),国际科技合作专项(2013DFG61520),重庆市集成示范计划(CSTC2013JCSF70003),中央高校基本科研业务费专项基金(CDJZR12150074)和重庆市研究生科研创新(CYB14014)项目资助. (51377184)

电工技术学报

OA北大核心CSCDCSTPCD

1000-6753

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