发光学报2017，Vol.38Issue(5)：655-661,7.DOI:10.3788/fgxb20173805.0655
封装热应力致半导体激光器“Smile"效应的抑制方法
Measures to Reduce Smile Effect of Semiconductor Laser Diode Arrays Caused by Packaging Thermal Stress
摘要
Abstract
The smile effect caused by thermal stress is a common problem in high power semiconductor laser array packaging.The mechanism of smile effect caused by packaging thermal stress was studied firstly.Then two measures,the differential temperature soldering technique and the prestressing force technique,were putted forward.The feasibility and effectiveness of the above mentioned techniques,were studied through the simulation method for an 808 nm semiconductor laser diode array.Using the traditional soldering technique,the smile effect is about 39.36 μm at 22 ℃.Using the differential temperature soldering technique,increasing the chip's temperature to 429 ℃ before soldering can reduce the smile effect to 1.9 μm.Using the prestressing force technique,applying a tensile force of 190 N along the long axis direction on each side of the heat sink can reduce the smile effect to 0.35 μm.Both techniques are proved to be effective.The two techniques are easy to implement,and the prestressing force technique can be used to adjust or modify various smile effect types and different smile values.关键词
半导体激光器/smile效应/热应力/错温封装/预应力Key words
semiconductor laser diode/smile effect/thermal effect/differential temperature soldering/prestressing force分类
信息技术与安全科学引用本文复制引用
陈华,李静,周兴林,吕悦晶..封装热应力致半导体激光器“Smile"效应的抑制方法[J].发光学报,2017,38(5):655-661,7.基金项目
湖北省自然科学基金面上项目(2015CFB220) （2015CFB220）
湖北省科技支撑计划(2014BEC055) （2014BEC055）
国家自然科学基金面上项目(51578430) （51578430）
武汉科技大学青年科技骨干培育计划资助项目 Supported by General Program of Natural Science Foundation of Hubei province (2015CFB220) （2015CFB220）
Hubei Science and Technology Support Program(2014BEC055) （2014BEC055）
General Program of Natural Science Foundation of China (51578430) （51578430）
Youth Science and Technology Backbone Training Program of Wuhan University of Science and Technology （）
