金刚石与磨料磨具工程2017，Vol.37Issue(3)：40-45,6.DOI:10.13394/j.cnki.jgszz.2017.3.0009
激光晶片抛光中磨粒运动轨迹分布均匀性分析
Analysis on uniformity of particle trajectories in laser wafer polishing
摘要
Abstract
To analyze effect of rotation ratio α and swing ratio β on distribution uniformity of grain trajectory during wafer polishing, two models are established, namely relative velocity between wafer and pad, and grain trajectory on wafer surface.Distribution law of relative velocity and particle trajectory density statistics are studied.Results show that when the rotation speeds of wafer and pad are kept consistent, the relative speed is stable.It is also found that the reciprocating motion of wafer following polishing head mainly influences periodicity of relative speed changes and randomness of grain trajectory distribution.In conclusion, when α =1.01 and β =0.2, the homogeneity of grain trajectory distribution on wafer is the best.关键词
速度分布/转动比/摆动比/轨迹密度Key words
speed distribution/rotation ratio/swing ratio/trajectory density分类
矿业与冶金引用本文复制引用
康仁科,赵海洋,朱祥龙,焦振华..激光晶片抛光中磨粒运动轨迹分布均匀性分析[J].金刚石与磨料磨具工程,2017,37(3):40-45,6.基金项目
国家自然科学基金项目(91323302) （91323302）
国家重点研发计划项目(2016YFB1102205). （2016YFB1102205）
