金刚石与磨料磨具工程2017，Vol.37Issue(2)：6-10,5.DOI:10.13394/j.cnki.jgszz.2017.2.0002
金刚石砂轮磨削单晶硅片面形变化规律
Characterization of wafer shape after grinding with diamond wheel
摘要
Abstract
Subsurface damage is formed in the silicon wafer during the thinning process,where residual stress causes defects.Therefore,variation law of the warping profile was studied in the silicon wafer without spark-out process.The silicon wafers were thinned to 400 μm or 450μm by a diamond grinding wheel and their warping profiles were measured.The silicon surface profile was divided into five rings from the center to the edge in radial direction and the radius of curvature of each area was obtained by spherical fit respectively.By analyzing the warping profile,it is found that the deformation of the silicon wafer increases from the central area to the edge and it implies that the residual stress grows and so does the grinding damage.In addition,it is found that the crystal orientation has a significant effect on the deformation of silicon wafer,thus the deformation in the <110> crystal orientation area quite different from that in the <100> crystal orientation area.关键词
磨削硅片/残余应力/曲率/晶向Key words
wafer grinding/residual stress/curvature/crystal orientation分类
矿业与冶金引用本文复制引用
陈修艺,刘海军,朱祥龙,康仁科,董志刚..金刚石砂轮磨削单晶硅片面形变化规律[J].金刚石与磨料磨具工程,2017,37(2):6-10,5.基金项目
国家自然科学基金(51575085,91323302) （51575085,91323302）
国家科技重大专项子课题(2014ZX02504001). （2014ZX02504001）
