计算机应用研究2017，Vol.34Issue(8)：2395-2398,4.DOI:10.3969/j.issn.1001-3695.2017.08.036
基于温度感知任务调度的3D NoC混合拓扑结构
3D NoC hybrid topology based on thermal-aware task migration
摘要
Abstract
High power density of 3D NoC system is easy to cause on chip high temperature problem, which has a destructive effect on the system performance and chip reliability.Thermal aware task scheduling method mean to migrate hot task to relative cool task, but this way will increase the communication distance between the two node, and then has a destructive affection of overall performance.Therefor it needs to keep the original low communication overhead when using task migration met-hod.This paper proposed a hierarchical ring/mesh hybrid 3D NoC topology: RMH.This topology could balance the communication need and thermal need of 3D NoC system.RMH could keep original communication overhead when tasks migrated.The simulation results show that, compared to the traditional topology, the RMH topology can effectively alleviate the thermal problem, and reduces 31.1% of network latency on average.关键词
众核芯片/片上网络/任务调度/三维混合拓扑Key words
many-core chip/network on chip/task migration/3D hybrid topology分类
信息技术与安全科学引用本文复制引用
冯申杰,李冰,程良伦..基于温度感知任务调度的3D NoC混合拓扑结构[J].计算机应用研究,2017,34(8):2395-2398,4.基金项目
广东省战略性新兴产业发展专项资助项目(2012A09100013) （2012A09100013）
广东省联合基金重点资助项目(U2012A002D01) （U2012A002D01）
