原子与分子物理学报2017，Vol.34Issue(4)：779-785,7.DOI:10.3969/j.issn.1000-0364.2017.04.031
基于多尺度模拟研究Ni/Cu薄膜压痕塑性的原子机制
Atomistic mechanisms of the incipient plasticity of nano-indented Ni/Cu films via multi-scale simulations
摘要
Abstract
The atomistic mechanisms of the incipient plasticity of nano-indented Ni/Cu bi-layer films were studied by using the quasicontinuum multi-scale simulations.Results show that (1) the critical contact force under elastic limit condition decreases with the thickness of Ni layer, when the thickness of Ni layer is less than 10 nm, there is a weakening effect of Ni/Cu films: (2) the operation of Shockley partial dislocation, disassociation of interface dislocation, and interactions between interface dislocations and lattice dislocations are the main mechanisms of the incipient plasticity of Ni/Cu films;(3) decreasing of the amount of activated interface dislocations is the main reason for the weakening of Ni/Cu films, based on further defect structure observations and theoretical calculations.Studies on the mechanical behavior of heterogeneous interfaces can be benefit from the present research results.关键词
纳米薄膜/多尺度模拟/原子机制/初始塑性Key words
Nano-films/Multis-cale simulations/Atomistic mechanisms/Incipient plasticity分类
数理科学引用本文复制引用
邵宇飞,高科,杨鑫,李久会,赵星..基于多尺度模拟研究Ni/Cu薄膜压痕塑性的原子机制[J].原子与分子物理学报,2017,34(4):779-785,7.基金项目
国家自然科学基金(51404126) （51404126）
辽宁省教育厅一般科学研究项目(L2014135) （L2014135）
辽宁省自然科学基金(201602360) （201602360）
