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封装内气体对电热驱动MEMS性能影响的有限元分析

李长安 江毅 全本庆 杨宇翔 杨明冬

传感技术学报2017,Vol.30Issue(8):1167-1170,4.
传感技术学报2017,Vol.30Issue(8):1167-1170,4.DOI:10.3969/j.issn.1004-1699.2017.08.006

封装内气体对电热驱动MEMS性能影响的有限元分析

FEM Analysis of Influence of Insert Packaging Gas Composition onElectrothermal MEMS Device Performance

李长安 1江毅 1全本庆 1杨宇翔 1杨明冬1

作者信息

  • 1. 武汉光迅科技股份有限公司,武汉 430205
  • 折叠

摘要

Abstract

The influence of insert packaging gas composition on electrothermal Micro-Electro-Mechanical-System(MEMS)device performance is studied in this paper.With finite element method,both the temperature field and thermal deformation of the MEMS under different composition of mixed insert packaging gas are obtained.The results show that with the increase of helium content in the mixed gas,the thermal conductivity of the mixed gas increases,the temperature difference on the MEMS arm decreases,and the driven displacement decreases.In order to improve the performance of MEMS device and maintain the consistency of the product,the helium which is used for leak detection should be as less as possible within the requirement of lead detection process,and the content of insert packaging gas should be kept stable.

关键词

器件封装/热驱动MEMS/气体含量/有限元分析

Key words

inside device package/electrothermal MEMS/insert packaging gas composition/finite element analysis

分类

信息技术与安全科学

引用本文复制引用

李长安,江毅,全本庆,杨宇翔,杨明冬..封装内气体对电热驱动MEMS性能影响的有限元分析[J].传感技术学报,2017,30(8):1167-1170,4.

传感技术学报

OA北大核心CSCDCSTPCD

1004-1699

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