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Shear strength of LED solder joints using SAC-nano Cu solder pastes

Yang Liu Fenglian Sun Ping Liu Xiaolong Gu Guoqi Zhang

半导体学报（英文版）2017，Vol.38Issue(9)：90-94,5.

半导体学报（英文版）2017，Vol.38Issue(9)：90-94,5.DOI:10.1088/1674-4926/38/9/096003

Shear strength of LED solder joints using SAC-nano Cu solder pastes

Yang Liu ¹Fenglian Sun ²Ping Liu ¹Xiaolong Gu ³Guoqi Zhang³

作者信息

1. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
2. DIMES Center for SSL Technologies, Delft University of Technology, Delft 2628CT, Netherlands
3. Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China
折叠

摘要

关键词

shear strength/LED/solder/nano Cu/microstructure

Key words

shear strength/LED/solder/nano Cu/microstructure

引用本文复制引用

Yang Liu,Fenglian Sun,Ping Liu,Xiaolong Gu,Guoqi Zhang..Shear strength of LED solder joints using SAC-nano Cu solder pastes[J].半导体学报（英文版）,2017,38(9):90-94,5.

基金项目

Project supported by the National Natural Science Foundation of China (No.51604090) and the Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology (No.1402). （No.51604090）

半导体学报（英文版）

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ISSN：1674-4926

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