现代制造工程Issue(9)：8-12,5.DOI:10.16731/j.cnki.1671-3133.2017.09.002
双面研磨蓝宝石衬底面形及表面粗糙度变化过程的实验研究
Experimental research on the changing process of sapphire substrate surface shape and surface roughness in double-sided lapping
摘要
Abstract
Double-sided lapping is an important process in manufacturing the sapphire substrate.The main purpose is to remove the cutting marks on the wafer surface and make surface roughness homogeneous ,at the same time,improve the wafer surface shape accuracy ,make its meet certain specifications.The changing process of sapphire substrate surface shape ( Warp, Bow and TTV) and surface roughness in double-sided lapping was studied by carrying out lapping experiments.In the initial stage of doub-le-sided lapping,Warp decreases rapidly,Bow decreases slow,while TTV and the surface roughness Ra increase rapidly,but then, Warp,TTV and the surface roughness Ra have a little decrease with an increase of material removal.Bow decreases gradually to a stable value as the material removal increases.The research results have an important significance to optimize processing ,improve machining precision and machining efficiency for double-sided lapping sapphire wafer.关键词
蓝宝石/双面研磨/面形精度/粗糙度/去除量Key words
sapphire/double-sided lapping/accuracy of surface shape/roughness/removal分类
机械制造引用本文复制引用
邵铭剑,胡中伟,张志斌,谢斌晖..双面研磨蓝宝石衬底面形及表面粗糙度变化过程的实验研究[J].现代制造工程,2017,(9):8-12,5.基金项目
国家自然科学基金-海峡联合基金重点项目(U1305241) （U1305241）
华侨大学中青年教师科研提升资助计划项目(Z14J0009) （Z14J0009）
华侨大学引进高层次人才科研启动费项目(12BS203) （12BS203）
华侨大学研究生科研创新能力培育计划资助项目 （）
